this is information on a product in full production. march 2014 docid16953 rev 2 1/9 stps20100hr aerospace 1 x 20 and 2 x 20 a - 100 v schottky rectifier datasheet - production data features ? forward current: 1 x 20 and 2 x 20 a ? repetitive peak voltage: 100 v ? low forward voltage drop: 0.8 v ? maximum junction temperature: 175 c ? negligible switching losses ? low capacitance ? high reverse avalan che surge capability ? hermetic packages ? target radiation qualification: ? 150 krad (si) low dose rate ? 1 mrad high dose rate ? escc qualified description this power schottky rectifier is designed and packaged to comply with the escc5000 specification for aerospace products. housed in hermetically sealed packages both surface mount and through hole, it is ideal for use in applications for aerospace and other harsh environments. the stps20100hr is intended for use in medium voltage application and particularly, in high frequency circuits where low switching losses and low noise are required. to-254 smd.5 table 1. device summary order code escc detailed specification quality level package eppl i f (av) v rrm t j (max) v f (max) stps20100s1 - engineering model smd.5 - 1 x 20 100 175 1 stps20100a2fy1 - engineering model to-254 - 2 x 20 stps20100c2fy1 - engineering model to-254 - 2 x 20 stps20100sg 5106/016/05 escc flight smd.5 yes 1 x 20 stps20100a2fyt 5106/016/02 escc flight to-254 - 2 x 20 STPS20100C2FYT 5106/016/03 escc flight to-254 - 2 x 20 stps20100fyt 5106/016/01 escc flight to-254 - 1 x 20 www.st.com
characteristics stps20100hr 2/9 docid16953 rev 2 1 characteristics table 2. absolute maximum ratings symbol characteristic value unit i fsm forward surge current (per diode) (1) 1. sinusoidal pulse of 10 ms duration 250 a v rrm repetitive peak reverse voltage (2) 2. pulsed, duration 5 ms, f = 50 hz 100 v i rrm repetitive peak reverse current (3) 3. pulsed, duration 2 s, f = 1 khz 1a i o average output rectified current (50% duty cycle): (4) , (5) all variants (per diode) variants 02, and 03 (per device) 4. for t case > +140 c, derate linearly to 0 a at +175 c. 5. the ?per device? ratings apply only as follows: variant 02: when both cathode terminals are tied together variant 03: when both anode terminals are tied together. 20 40 a i f(rms) forward rms current (per diode) 30 a t op operating temperature range (6) (case temperature) 6. for variants with hot solder dip lead finish all testing performed at t amb > +125 c are carried out in a 100% inert atmosphere. -65 to +175 c t j junction temperature +175 c t stg storage temperature range (6) -65 to +175 c t sol soldering temperature: for to-254 (7) for smd.5 (8) 7. duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be resoldered until 3 minutes have elapsed. 8. duration 5 seconds maximum and the same package shall not be resoldered until 3 minutes have elapsed. +260 +245 o c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol characteristic value unit r th(j-c) (1) 1. package mounted on infinite heatsink thermal resistance, junction to case variants 01, and 05 variants 02 and 03 (per diode) variants 02, and 03 (per device) (2) 2. the per device ratings apply for variant 02 when both cathode terminals are tied together and for variant 03 when both anode terminals are tied together. 1.65 1.65 0.85 c/w
docid16953 rev 2 3/9 stps20100hr characteristics 9 s table 4. electrical measurements at ambiant temperature (per diode), t amb = 22 3 c symbol characteristic mil-std-750 test method test conditions values units min. max. i r reverse current 4016 dc method, v r = 100 v - 30 a v f1 (1) forward voltage 4011 pulse method, i f = 10 a - 780 mv v f2 (1) pulse method, i f = 20 a - 1 v c capacitance 4001 v r = 10 v, f = 1 mhz - 700 pf z th(j-c) relative thermal impedance, junction to case 3101 i h = 15 to 40 a, t h = 50 ms i m = 50 ma, t md = 100 s calculate v f c/w 1. pulse width 680s, duty cycle 2% table 5. electrical measurements at high and low temperatures (per diode) symbol characteristic mil-std-750 test method test conditions values units min. max. i r reverse current 4016 t case = +125 (+0, -5) c dc method, v r = 100 v -20ma v f2 (1) forward voltage 4011 t case = +125 (+0, -5) c pulse method, i f = 20 a -900mv t case = -55 (+5, -0) c pulse method, i f = 20 a -1.1v 1. pulse width 680s, duty cycle 2%
configurations stps20100hr 4/9 docid16953 rev 2 2 configurations figure 1. available device configurations 1 2 3 2 1 3 2 1 3 1 3 variant 01 stps20100fsyhrb variant 02 stps20100afsy1 stps20100afsyhrb variant 03 stps20100cfsy1 stps20100cfsyhrb variant 05 stps20100s1 stps20100shrb terminal 1: terminal 2: terminal 3: cathode no connection anode terminal 1: terminal 2: terminal 3: terminal 1: terminal 2: terminal 3: terminal 1: terminal 2: terminal 3: for to-254 the case is not connected to any lead for smd.5 the lid is not connected to any terminal cathode a common anode cathode b anode a common cathode anode b anode anode cathode
docid16953 rev 2 5/9 stps20100hr package information 9 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 2. metal flange mount package (to-254 (a) ), 3 lead dimension definitions a. the terminal identification is specified by the device configuration. see figure 1 for terminal connections b a c d e ?f g h ?i j k k l ?m n r1 r2 1 2 3
package information stps20100hr 6/9 docid16953 rev 2 table 6. metal flange mount package (to-254), 3-lead dimension values reference dimension in millimetres dimlension in inches min. max. min. max. a 13.59 13.84 0.535 0.545 b 13.59 13.84 0.535 0.545 c 20.07 20.32 0.790 0.800 d 6.3 6.7 0.248 0.264 e 1 3.9 0.039 0.154 ?f 3.5 3.9 0.138 0.154 g 16.89 17.4 0.665 0.685 h 6.86 bsc 0.270 bsc ?i (1) 1. 3 locations 0.89 1.14 0.035 0.045 j 3.81 bsc 0.150 bsc k 3.81 bsc 0.150 bsc l 12.95 14.5 0.510 0.571 ?m 3.05 typ. 0.120 typ. n - 0.71 - 0.028 r1 (2) 2. radius of heatsink flange corner - 4 locations -1-0.039 r2 (3) 3. radius of body corner - 4 locations 1.65 typ. 0.065
docid16953 rev 2 7/9 stps20100hr package information 9 figure 3. surface mount package (smd.5), 3-terminal dimension definitions table 7. surface mount package (smd.5), 3-terminal dimension values reference dimension in millimetres dimlension in inches min. max. min. max. a 2.84 3.15 0.112 0.124 a1 0.25 0.51 0.010 0.20 b 7.13 7.39 0.281 0.291 b1 5.58 5.84 0.220 0.230 b2 (1) 1. 2 locations 2.28 2.54 0.090 0.100 b3 (1) 2.92 3.18 0.115 0.125 d 10.03 10.28 0.395 0.405 d1 (1) 0.76 - 0.030 - e 7.39 7.64 0.291 0.301 e (1) 1.91 bsc 0.075 1 2 3 a a1 b b1 b2 b3 d1 e e d
ordering information stps20100hr 8/9 docid16953 rev 2 4 ordering information 5 revision history table 8. ordering information order code escc detailed specification package lead finish comment marking (1) mass eppl packing stps20100s1 - smd.5 gold single die stps20100s1 2 - strip pack stps20100a2fy1 - to-254 gold double die - common anode stps20100afy1 + beo 10 - stps20100c2fy1 - to-254 gold double die - common cathode stps20100cfy1 + beo 10 - stps20100sg 5106/016/05 smd.5 gold single die 510601605 2 yes stps20100a2fyt 5106/016/02 to-254 solder dip double die - common anode 510601602 +beo 10 - STPS20100C2FYT 5106/016/03 to-254 solder dip double die - common cathode 510601603 +beo 10 - stps20100fyt 5106/016/01 to-254 solder dip single die 510601601 +beo 10 - 1. specific marking only. the full marking includes in addition: for the engineering models: st logo, date code, country of origin (fr). for escc flight parts: st logo, date code, country of origin (fr), esa logo, serial number of the part within the assembly lot. table 9. document revision history date revision changes 25-mar-2010 1 initial release. 19-mar-2014 2 updated table 1: device summary , table 8: ordering information and figure 1: available device configurations .
docid16953 rev 2 9/9 stps20100hr 9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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